Silicon Nitride Polishing

Oct 31, 2025

Tso lus

1. Pib
Hauv kev nrhiav cov kev ua tau zoo thiab kev ntseeg tau rau semiconductors thiab txiav {{0} {ntug kev tseem ceeb vim nws qhov kev zam tshwj xeeb ntawm cov khoom. Nws muab lub siab tawv, zoo heev puas nyuaj, tshuaj lom neeg zoo, ib qho qis coefficient ntawm thermal expansion, thiab rwb thaiv tsev zoo tshaj plaws. Cov yam ntxwv no ua rau nws cov khoom siv zoo tshaj plaws rau kev tsim cov ntsiab lus tseem ceeb xws li highulating cov txheej txheem, thermal kev tswj cov txheej txheem, thiab Windows optical.

Kev siv cov ntaub ntawv zoo li cov ntaub ntawv nyuaj thiab cov pob zeb plhaw thiab sapphire, hemei corilation tau tsim lub cev muaj zog tshwj xeeb rau silicon nitride submates. Cov txheej txheem no ua tau zoo thiab xwm yeem cov txheej txheem silicon nitride wafers mus rau ib tug "}}} Cov khoom lag luam du zoo li.

2. Daim ntawv thov yuav tsum muaj
Cov hom phiaj polishing rau silicon nitride wafpers dlisign nrog rau lwm cov ntaub ntawv tuab: thinning concentic cov ntaub ntawv (ra) kom tsawg dua 2 nanometers.

Yuav kom ua tiav cov hom phiaj no, kev ua haujlwm heme-aus ua ntej ua ntej muaj cov silicon nitride wafer rau ib tug quartz iav cabrier disk siv tag nrho wafeling freating system. Qhov no ua kom pom tseeb kev ruaj khov thiab parallelism thaum ua. Tom qab, ob - Cov kauj ruam uas muaj cov txheej txheem precision full - Cov txheej txheem kev tswj hwm los ntawm cov khoom siv sai sai.

3. Cov Kev Ntsuas Cov Txheej Txheem
Hemei tus qauv polishing cuag tau hloov pauv silicon nitride wafers ntawm ntau qhov ntau thiab tsawg thiab batch ntau. Cov txheej txheem tseem ceeb muaj xws li:

HSM - l / hsm -}} lp Series Sib Tsoo Ntaus:Siv rau thawj zaug precision sib tsoo theem.

HSM - CMP Series Neeg Kho Tshuab Polishing:Siv rau qhov kawg ultra - precision polishing, ua tiav nanoscale nto tas.

Qhov tseem ceeb SHOOGATEMS:

WAFER BORTING UNIT (WB):Ua kom muaj siab siab - precision khi ntawm lub wafer rau cov cab kuj.

SJ / Asj Series Precision Polishing Fixtures:Muab ruaj khov thiab txhim khu kev qha clamping daws.

C - Asj Tsav Taub Hau Siab - Ceev Polishing System:Pab kom muaj peev xwm tshem tawm thiab muaj kev sib raug zoo.

4. Ua Flow

4.1 Mounting, kho, thiab kev sib tsoo

Tsevneeg Khuv:Siv HEMEI WB Tsevneeg tuam txhab sib txuas ua ke rau Silicon Nitride Wafer rau quartz iav txhawb nqa disk. Cov kab ke no tuaj yeem them nyiaj rau tuab ntau ntau yam sib txawv ntawm cov wafiat wort, ua kom pom kev zoo thaum pib parallelism.

Fixturing:Mount qhov sib khi ua rau hauv lub tshuab nqus tsev ntawm SJ lossis Asj series Polishing fixture.

Sib tsoo:Mob siab rau lub ntsej muag yog li Wafture lub ntsej muag yog downward rau hauv lub pob sib tsoo ntawm HSM - l khoom siv. Lub kaw lus ua haujlwm ntawm kev nrawm txog 130 RPM, thaum lub caij metering twj ua rau kev sib tsoo ntawm cov phaj ntawm tus nqi txaus. Cov kauj ruam no ua rau tshem tawm cov khoom ntawm cov khoom kom sai thiab tsis sib xws, thaum preliminarily tswj cov kev hloov tuab.

4.2 Mounting, kho, thiab polishing

Hloov chaw:Tom qab sib tsoo, ntxuav cov wafer thiab tshem tawm nws los ntawm iav cab kuj disk.

Precision polishing:

Xaiv A (siab - precision nyiam):Siv HEMEI HSM - cmp system. Lub wafer yog ncaj qha tsau rau ib lub taub hau customized los ntawm dej nqus los yog nqus tsev, tshem tawm qhov xav tau ntawm kev sib khi thib ob. Cov kab ke no muaj cov txheej txheem kev muaj txheej txheem siab; Cov ntsiab lus tseem ceeb xws li Platen Ceev, Downforce, thiab Slurry Flow tus nqi tuaj yeem hloov kho cov ntaub ntawv tshem tawm (MRR) thiab qhov zoo.

Kev xaiv B (Siab - econdioncient Lwm yam):Thauj cov wafefer rau cov kab ke rau ib polishenic fixture tau muaj nrog c {}} as - ceev polishing.

5. Cov txiaj ntsig
Siv HEMEI polishing system rau silicon nitride submes yield {}}} {}}} zaj duab xis}} kev ua zaj duab xis lossis cov txheej txheem sib dhos. Txhua tus polished wafer ua tiav cov khoom siv tsis sib xws thiab 极高的表面平整度 (uas tsis tshua muaj neeg nyob zoo).

Los ntawm kev ua cov txheej txheem ua kom zoo dua (xws li cov txheej txheem kev ua haujlwm siab), HEMEI txheej txheem tuaj yeem ua tiav cov ntaub ntawv tshem tawm kev tshem tawm zoo (MRR) rau silicon nitride ntawm1.5 - 3 μm / teev, tawm tsam kev sib npaug ntawm kev ua tau zoo thiab qhov zoo.

Cov ntaub ntawv hauv qab no yog raws li cov txiaj ntsig ntsuas los ntawm ib pob ntawm kaum 2 {} nti sich silicon nitride wafers ua tiav ntawm HSM-CMP system:

Chaw ua uas tsis tau haus Tom qab sib tsoo (pib) Tom qab polishing (kawg) Phiaj xwm qhia meej
Nto roughness (ra) ~ 110 nm ​< 1.5 nm Ra <2 nm
Ttv - ​< ±1.5 μm Ttv <± 2 μm
Mrr - 1.5 - 3 μm/h -
Txoj hluas - ​< 20 μm Nyo hau <25 μm
Qhov saum toj no parameter ua yog siv xwb yog hemei semiconductor (Suzhou) lab.      

Raug tshwm sim rau Silicon Nitride Wafers

Inch:2 nti (kho kom loj dua rau qhov ntau thiab tsawg)

Cov Khoom Siv Tshem Tawm (MRR):1.5 - 3 μm / teev

Thaum kawg RA tus nqi:<1.5 nm

Flats (TTV):<± 1.5 μm

Txoj hau:<20 μm
Qhov saum toj no parameter ua yog siv xwb yog hemei semiconductor (Suzhou) lab.

Ntsiab lus:HEMEI cov kev daws teeb polishing muaj ntau lawm - Tus Nanoscale nto tas thiab Micron-}}} cov ntawv ntsuas pom tseeb. Qhov no robustly txhawb kev lag luam ntawm silicon nitride nyob rau hauv ntau qhov siab-}}} daim ntawv thov.

Lapping and polishing processes for silicon carbide, sapphire, and gallium nitride

Xa kev nug