Gallium arsenide (gaas) semiconductor ua tshuab ua
Lub hauv paus rau phau ntawv
Daim Ntawv Thov Yuav Tsum Tau
Cov Lus Qhia Tshwj Xeeb
Zauv Zuag
Neeg Cov Ntaub Ntawv
Gallium arsenide (gaas) tau siv dav hauv qhov kev sib txuas lus siab, photog xov tooj cua, thiab micretave cov khoom sib txuas lus, thiab micretave confility, bandgap ntau, thiab kev ua tau zoo rf. Gaas {- Kev ua khoom siv Irreplacleable txoj haujlwm nyob rau hauv 5g kev sib txuas lus, ci radar, thiab kev sib xyaw Optoelectronic ci ntsa iab. Txhawm rau kom tau raws li qhov xav tau ntawm qhov siab - Kev ua tau zoo ntaus ntawv kom tshem tawm cov tshuaj sib tsoo, kom ua tiav qhov tseeb thiab muaj kev ntseeg tau ntawm cov ntaub ntawv txuas ntxiv.
Daim Ntawv Thov Yuav Tsum Tau
Gaas Wafer kev ua haujlwm yuav tsum ua tiav cov hom phiaj hauv qab no:
SOOS ROHOHOOS: POST {- polishing ra tsawg dua lossis sib npaug rau 1 nm
Tag nrho cov tuab tuab (TTV): kawg Wafer ttv tsawg dua los yog sib npaug rau 2 μm
Thickness tswj: lub hom phiaj thickness 150 μm (raug rau cov neeg siv khoom)
Ntug Ciaj: Tiv Thaiv Txhuam thiab Ua kom muaj kev ncaj ncees ntawm thaj chaw ntaus ntawv.
Cov Lus Qhia Tshwj Xeeb
HSM precision lapping thiab polishing system muab tag nrho - txheej txheem daws teeb meem.
Zauv Zuag
Lapping Kev Npaj
Siv lub ntsej muag ntsuas lub ntsej muag rau calibrate cov convinest ntawm cov iav lapping platen (siv los them rau polishing ntug cuam tshuam).
Ntsaws cov gaas wafer rau hauv cov khoom noj tshwj xeeb (ASJ). Ua ob {- theem lapping siv alumina slurry:
Theem 1: Tshem tawm cov kev puas tsuaj dhau los, txo qis roughness rau 250-350 nm.
Theem 2: Txhim Kho Kev Ncaj Ncees, ua tiav roughness ntawm 200-350 nm thiab ttv tsawg dua lossis sib npaug rau 3 μm.
Nco tseg: Cov abrasive particle loj yuav tsum tau txiav txim siab raws li thawj zaug thiab kawg tuab ntawm cov qauv; Yog tsis muaj qhov loj ruaj khov.
Kev Npaj Polishing
Hloov cov hniav sib tsoo platen nrog tus polishing ncoo thiab hloov cov abrasive rau hsm tshwj xeeb polishing slurry.
Tswj cov ntsiab lus tseem ceeb ntawm cov duab graphical interface:
Polishing Platen Ceev: Tsawg dua lossis sib npaug rau 100 rpm
Slurry flow tus nqi: saib xyuas los ntawm qhov tseeb -}}} dej pub tswj cov tshuab (txo cov khib nyiab)
Siab thau khoom: dynamically hloov kho raws cov kev xav tau tuab.
Lub Hom Phiaj: Tshem tawm sub - kev puas tsuaj thiab ua tiav atomically du nto (ra tsawg dua lossis sib npaug nrog 1 nm).
Qho kawg
Lub 4 - nti} nti gaas gaas wafers tiav los ntawm HSM-LP system ua tiav cov kev ua hauv qab no:
Neeg Cov Ntaub Ntawv
Tus neeg siv khoom siv HSM - lp system ua cov txheej txheem 3-nti gaas wafer. Cov txheej txheem thiab cov txiaj ntsig tau muaj raws li hauv qab no:
Ob - theem sib tsoo:
Sib tsoo platen convexity calibrated rau lub hom phiaj curvature, zoo tswj ntug warping.
Cov khoom siv tshem tawm stepwise nrog alumina slurry, ttv stabilized ntawm 3 μm.
Polishing:
Polishing slurry ntws tus nqi ntws mus rau 50 ml / min, platen ceev ntawm 80 rpm.
Degarge roughness txo los ntawm 250 nm rau 0.8 nm (txheeb xyuas los ntawm kev cuam tshuam dawb lub teeb sib cuam tshuam).
Cov kev ntsuas zaum kawg:
Thickness: 150 ± 0.5 μm
Flats: TTV tsawg dua lossis sib npaug rau 1 μm
Ntug Kev Ntseeg: Tsis muaj CHIPPING, zoo ntug tiaj tiaj.
Kev siv tau
SCHEMATIC: DOS MAKPHITY ntawm Gaas Wafer tom qab ua los ntawm Hsm - lp system.
Sau ntawv:
Kev Ntsuas Cov Khoom: Bruker Contourgt Dawb Lub Teeb Kev Cuam Tshuam
Tag nrho - txheej txheem paib: ntau dua lossis sib npaug ntawm 96% (batch loj ntawm 30 wafers)
