Kev Nrhiav Kom Zoo Nkauj: Yuav ua li cas Wafer Lapping thiab Polishing Machine Ua Tau Zoo Atomic {}}}}}}}}}}}} qib siab tiaj
Nyob rau hauv lub plawv ntawm semiconductor tsim cov lus dag ib qho yooj yim tsis tau muaj txiaj ntsig tseem ceeb heev: cov tiaj tiaj. Rau cov microchips uas ntim ntau lab ntawm cov neeg muaj peev xwm rau hauv cov nplais ntawm silicon, txawm tias tsis txaus ntseeg, txawm yog lub roob, lub roob, kev cuam tshuam nrog cov khoom siv hluav taws xob thiab cov cuab yeej siv tsis tau. Qhov no yog qhov twg unsung heroes ntawm fab - Wafefer lapping thiab polishing tshuab- tuaj rau hauv kev ua si. Los ntawm kev ua yeeb yam me me rau txoj kev ua yeeb yam ob-}} Cov kauj ruam silicon wafpers rau hauv cov lus qhia rau liith rau Lithography.
Vim li cas flavness tsis yog - kev sib ceg
Hauv photolithography, cov txheej txheem ntawm cov qauv luam ntawv, lub teeb yog npaj rau hauv wafer los ntawm cov lens nyuaj. Txhua qhov sib txawv ntawm cov duab zoo nkauj muab cov duab tawm ntawm kev ua kom pom tseeb ntawm cov ntsiab lus sib txawv hla cov wafer. Xav txog qhov ua tiav qhov projecting qhov siab - daws teeb meem duab rau hauv daim ntawv zuaj ntawm lub tiaj tus; Qhov tshwm sim yuav raug qhov muag plooj thiab distorted. Rau niaj hnub huab ultraviolet (EUV) lithography nrog nws incredibly ntiav qhov tob yog ntau dua li 100 nanometers hla lub voj voog 300mm nyob thoob plaws 300mm nyob thoob 300mm initive wafefer.
Theem 1: Lapping - txuj ci ntawm macroscopic precision
Txoj kev pib pib nrog kev nyab xeeb raw, uas tom qab slicing los ntawm ib qho - Crystal Ingot, muaj qhov kev puas tsuaj tseem ceeb, thiab warp. Lapping yog tus txhoj puab heev ua ntej los kho cov macroscopic tsis txaus ntseeg.
Tus Mechanism:
Lub tshuab lapping ib lossis ntau yam wafers hauv cov nqa khoom npliag hauv, uas tau muab tso rau ntawm ob loj, tawm tsam daim hlau (lapping daim hlau). Ib qho abrasive slurry ...-}}}}}}}}} - yog pub ntawm cov phiaj no. Raws li cov daim phiaj loj thiab qis dua tig, cov cab kuj uas cuam tshuam rau lub ntiaj chaw rau cov planetary planetary rau Wafers, kom muaj cov khoom siv sib txawv ntawm lawv qhov chaw tag nrho.
Ua tiav tiaj tus nyob rau hauv lapping:
1. Dual - eded cov khoom tshem tawm:Tsis zoo li ib qho {- kev sib tsoo ntawm ob tog cancels tawm kev ntxhov siab thiab tiv thaiv kev sib tw, zoo tshem tawm warp.
2. Precision phaj Flatness:Lopping daim hlau lawv tus kheej tau ua haujlwm ua haujlwm ua kom ncaj qha. Ib qho kev sib txawv hauv lub phaj yuav raug rau cov wafers.
3. Kev tswj hwm siab thiab pub:Lub tshuab siv tau meej meej calibrated downward siab thiab tswj cov ntws ntawm cov slurracas, tso cai rau kev twv xyuas. Lub hom phiaj ntawm no lub hom phiaj ntawm no tsis yog pristine nto tab sis yog ib tug geometrically zoo meej ib {}}}}}}) thiab ua tiav ua tiav cov hauv paus.
Tom qab lapping, wafer yog tiaj tab sis puas. Cov txheej txheem abrasive tawm ntawm cov txheej txheej tag nrho ntawm cov microfractures thiab kev nyuaj siab, tsis tsim nyog rau lub tsev rhiab siv hluav taws xob sib xyaw.
Theem 2: Polishing - txoj kev mus rau nanoscale smoothness
POLISHING POLISH tau siv sijhawm nyob qhov twg lapping xaus, hloov pauv cov tshuab puas, matte nto rau kev ua piv txwv zoo nkauj, atomically du daim iav. Txoj kev nquag thiab tseem ceeb tshaj plaws yog tshuaj kho tshuab polishing (CMP).
CMP me nyuam:
Cov wafer yog mounted upside -} down down {}}}}}} down down down down} down down down down} down down down down down down down down pad pading rau ntawm lub platen. Ib qho kev siv tshuaj tsw qab ntawm slurry yog dispensed mus rau hauv ncoo. Qhov slurry no yog tus yuam sij rau CMP txoj kev ua tiav, ua lub luag haujlwm zoo tshaj plaws:
Tshuaj lom neeg:Cov tshuaj lom neeg (piv txwv li, ib qho khoom siv collica {{2} Raws li txoj kev sib tw ntawm wafer
Neeg kho tshuab nkaus:Cov neeg phem nanoparticles abrasive nyob rau hauv slurry (tam sim no finer tshaj nyob rau hauv lapping) thiab cov asperper ntawm polishing padtically txhuam cov khoom muag muag.
Qhov kev sib xyaw ua ke no tso cai rau kev tshem tawm cov khoom ntawm yam tsis muaj kev qhia cov kev puas tsuaj tshiab.
Ua tiav qhov kawg tiaj tiaj nyob rau hauv polishing:
1. Multi - cheeb tsam cov cab kuj:Advanced polishing taub hau muaj qhov ua tau zoo ywj siab zones. Los ntawm dynamically hloov kho lub siab ntawm lub chaw thiab ntug ntawm Wafer, lub kaw lus tuaj yeem kho tau cov khoom seem, kom muaj cov khoom sib txawv ntawm qhov chaw mus rau ntug.
2. Hauv - situ metrology:Tiag tiag - lub sijhawm saib xyuas cov khoom tuaj yeem taug qab cov khoom tshem tawm thiab cov txheej txheem kho kom haum thiab ua kom haum rau txhua qhov chaw wafer.
3. Luam Yeeb Yam:Thaum lub sij hawm polishing, lub ncoo los ua glazed nrog breproducts. Ib sab caj npab sib xyaw nrog lub pob zeb diamond- {- Cov duab paug, uas yog qhov tseem ceeb rau kev tshem tawm cov nqi tshem tawm thiab kev sib dhos.
4. Kev tswj cov slurry:Kev tswj hwm kom meej los tswj cov slurry chemistry, kub thiab txaus tus nqi yog qhov tseem ceeb. Kev sib txawv tuaj yeem ua rau tsis yog - Uniform etching lossis "inghing" ntawm cov nta, rhuav tshem hauv zos.
Xaus: Daim Ntawv Nkauj ntawm Engineering
Kev ua tiav ntawm kev nyab xeeb zoo nkauj Fleet tsis yog qhov tshwm sim los ntawm ib lub tshuab txuj ci tseem ceeb tab sis ib lub suab ntawm cov kev siv tshuab, kev ntsuas thiab tswj. Lapping muab cov pob zeb geometric zoo tag nrho los ntawm brute - quab yuam, dual {2} ated ovrasion. Polishing zoo li tsa cov hauv paus no rau ib qho atomic {}}} qib tiav los ntawm kev sib txig sib luag ntawm cov tshuaj lom neeg xws li kev siv tshuab. Ua ke, cov txheej txheem no ua kom txhua tus muaj kev tiv thaiv ib ce zoo kawg nkaus, qhov tsis zoo}}}} dawb canator, ua kom cov miniaturization dawb thiab lub zog ntawm lub ntiaj teb digital. Yog tsis muaj qhov qab no - -} scenes Lub Peb Hlis Ntuj ntawm Moore txoj cai yuav tsoo tau nres.
